PRODUCT
Thermal Evaporator
EasyDEP-7
SPECIFICATIONS
| Deposition materials | Metal : Ag, Al, Au, Cu, Sn, Ti, Ni,... Oxide : MoO3, NiO, WO3,.. |
|---|---|
| Substrate size | Max. 400mm x 400mm |
| Product yield | 22 wafers/run@4inch, 9 wafers/run@6inch, 3 wafers/run@8inch |
| Substrate rotation | 0 to 20 rpm |
| No of boats | 1 to 6 ea |
| Thermal power | 1.5 to 3 kw |
| Thickness controller | Single Q’tz crystal sensor & controller |
| Ultimate pressure | < 5.0E-7 Torr (Cryo pump or TMP) |
| Option | Co-evaporation, Substrate Heating |
| Control | PC control (UPRO software) |
| Dimension (W*D*H) | 1,600mm X 1,450mm X 2,060mm |