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DRY ETCHER
SPUTTER
DRY ETCHER
PECVD
ALD
E beam evaporator
Thermal Evaporator
Glovebox+PVD
2D material CVD
LPCVD & Furnace
Vacuum Sintering Furnace
RTP
Plasma Doping (PDS)
ASHER
Wet bench
Crystal Si solarcell
SPUTTER
DRY ETCHER
PECVD
ALD
E beam evaporator
Thermal Evaporator
Glovebox+PVD
2D material CVD
LPCVD & Furnace
Vacuum Sintering Furnace
RTP
Plasma Doping (PDS)
ASHER
Wet bench
Crystal Si solarcell
SPUTTER
DRY ETCHER
PECVD
ALD
E beam evaporator
Thermal Evaporator
Glovebox+PVD
2D material CVD
LPCVD & Furnace
Vacuum Sintering Furnace
RTP
Plasma Doping (PDS)
ASHER
Wet bench
Crystal Si solarcell
DRY ETCHER
PRODUCT
INTRODUCTION
Cross-view of MESA etching
Roughness
RMS (nm)
p-GaN
2.429
n-GaN (after etching)
3.915
Silicon 20nm Slip Line Etching
Cross-view of Poly Silicon etching
Cross-view of Silicon Etching
Trench pattern
Hole pattern
PERI-R Series
PERI-R Series
PERI-L Series
PERI-L Series
PERI-ICP Series
PERI-ICP Series
1
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COMPANY
Overview
History
Certification Status
Product Application
Contact Us
PRODUCT
SPUTTER
DRY ETCHER
PECVD
ALD
E beam evaporator
Thermal Evaporator
Glovebox+PVD
2D material CVD
LPCVD & Furnace
Vacuum Sintering Furnace
RTP
Plasma Doping (PDS)
ASHER
Wet bench
Crystal Si solarcell
RECRUIT
Type of Talent
Recruitment Guide
Recruitment Bulletin
PARTNERSHIP
Partnership
SUPPORT
Notice
Consultation Inquiry
Press Release
