PRODUCT
Thermal Evaporator
EasyDEP-N
SPECIFICATIONS
| Application | Nano structure deposition (3D junction network nano structure deposition) |
|---|---|
| Deposition materials | Metal : Ag, Al, Au, Cu, Pd, Ti,... Oxide : SnO2, ZnO, WO3,.. |
| Substrate size | Max. 6inch wafer |
| Product yield | 1 wafers/run@6inch |
| Substrate rotation | 0 to 20 rpm |
| No of boats | 1 to 2 ea |
| Thermal power | 1.5 to 3 kw |
| Thickness controller | Single Q’tz crystal sensor & controller |
| Ultimate pressure | < 5.0E-7 Torr (TMP) |
| Auto pressure control | Baratron gauge + throttle valve |
| Option | Sputter gun |
| Control | PC control (UPRO software) |