Thermal Evaporator



Application Nano structure deposition (3D junction network nano structure deposition)
Deposition materials Metal : Ag, Al, Au, Cu, Pd, Ti,... Oxide : SnO2, ZnO, WO3,..
Substrate size Max. 6inch wafer
Product yield 1 wafers/run@6inch
Substrate rotation 0 to 20 rpm
No of boats 1 to 2 ea
Thermal power 1.5 to 3 kw
Thickness controller Single Q’tz crystal sensor & controller
Ultimate pressure < 5.0E-7 Torr (TMP)
Auto pressure control Baratron gauge + throttle valve
Option Sputter gun
Control PC control (UPRO software)