PRODUCT
ASHER
EURA-W
SPECIFICATIONS
Process | Ashing, Descum, PR strip, Plasma cleaning,… |
---|---|
Substrate Size | Piece to Max. 12 inch |
Source injection | Two pattern showerhead |
Substrate temperature | Cooling or Max. 300℃ (@ wafer) |
RF power | 2KW @13.56Mhz |
Ultimate pressure | < 5.0×10-3 Torr |
Pump | Dry pump or Rotary pump |
Gas Supply | Ar, O2,..etc |
Deposition uniformity | ≤ ±5 % |
System control | PC control |
Dimension (w*d*h) | 800mm*800mm*1,150mm |