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E beam evaporator

SPUTTER
DRY ETCHER
PECVD
ALD
E beam evaporator
Thermal Evaporator
Glovebox+PVD
2D material CVD
LPCVD & Furnace
Vacuum Sintering Furnace
RTP
Plasma Doping (PDS)
ASHER
Wet bench
Crystal Si solarcell

SPUTTER
DRY ETCHER
PECVD
ALD
E beam evaporator
Thermal Evaporator
Glovebox+PVD
2D material CVD
LPCVD & Furnace
Vacuum Sintering Furnace
RTP
Plasma Doping (PDS)
ASHER
Wet bench
Crystal Si solarcell

E beam evaporator

PRODUCT
INTRODUCTION

Glow discharge (option)

Sample surface cleaning by Plasma (option)

Improve film Adhesion & quality

Improve film Adhesion & quality

Improve film Adhesion & quality

Process condition

Ni deposition test

Process condition

RS mapping

Process condition

MgO process

MgO process

MgO process

MgO on glass substrate
Deposition temperature :100 ℃
Thickness : 5000Å
Deposition rate : 3 Å/s

Process D (ITO + conventional dome)

ITO (density 7.18) Evaporation + Heating

MgO process

wavelength (nm)	10 sccm	30 sccm	80 sccm
550	83.05 %	96.32 %	91.51 %
550	14.87 Ω/sq (±1.50 %) ~ 290 nm	14.93 Ω/sq (±4.1 %) ~ 230 nm	57.87 (±6.41%) ~ 150 nm

SEE-5

제품명

대표사진

SEE-5

SEE-7

제품명

대표사진

SEE-7

SEE-UHV

제품명

대표사진

SEE-UHV

1

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